Abstract
We develop a new workflows with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can applies in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage and open defects. This paper introduces the capability and presents two case studies identifying the physical location of defects where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the methodology and application of DCT on open and short defects in advanced 2.5D IC has been presented. The experimental results of non-destructive tooling (X-ray) and P-FA (Physical Failure Analysis) verify the accuracy of the defect mapping function in determining the pin location to defect.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
