Dielectric properties of AlN films prepared by laser-induced chemical vapour deposition

Abstract

The dielectric properties and electrical conductivity of AlN films deposited by laser-induced chemical vapour deposition (LCVD) are studied for a range of growth conditions. The static dielectric constant is 8.0 ± 0.2 over the frequency range 10 2−10 7 Hz and breakdown electric fields better than 10 6 V cm −1 are found for all films grown at temperatures above 130°C. The resistivity of the films grown under optimum conditions (substrate temperature above 170°C, NH 3/TMA flow rate ratio greater than 300 and a deposition pressure of 1–2 Torr) is about 10 14 Ω cm and two conduction mechanisms can be identified. At low fields, F < 5 × 10 5 V cm −1 and conductivity is ohmic with a temperature dependence showing a thermal activation energy of 50–100 meV, compatible with the presumed shallow donor-like states. At high fields, F > 1 × 10 6 V cm −1, a Poole-Frenkel (field-induced emission) process dominates, with electrons activated from traps at about 0.7–1.2 eV below the conduction band edge. A trap in this depth region is well-known in AlN. At fields between 4 and 7 × 10 5 V cm −1 both conduction paths contribute significantly. The degradation of properties under non-ideal growth conditions of low temperature or low precursor V/III ratio is described.