Abstract
This study explores Through Glass Via (TGV) formation technology and metallization technology for glass interposer. 3D packaging has presently attracted lots of attention. The interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer are accelerated. Glass is expected as one of candidates as material of future interposer substrate because of its good electrical properties and scalability of substrate size leading to higher loading efficiency. This study demonstrates TGV formation showed capabilities of fine pitch and high dense, and TGV formation for standard thick glass aiming varied applications for packaging such as MEMS, Optical device, and RF devise. This study also demonstrates metallization for above fine pitch TGV substrate. Necessary future development and subjects are pointed out.
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