Abstract
A UV curable dielectric ink composition, which enables adaptable and high-resolution direct ink writing, is presented. The UV curable dielectric ink composition is designed using non-hazardous, low cost, commercially available ingredients. The ink manufacturing procedure was devised to require only fundamental lab equipment, without the need for complex reaction conditions or harmful processes. The UV dielectric ink composition was engineered to meet a range of direct ink writing application specific needs. These needs include a tailored rheology, cured film rigidity, dielectric performance, and adhesive ability. The versatility of this ink composition is demonstrated through the fabrication of dielectric bridges for printed coplanar waveguides, bare die chip integration, and interconnects between printed circuit board regions.
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