Abstract
Silver free AMB technology addresses the cost-performance gap between the active metal brazed (AMB) Si3N4 based metal ceramic substrates (MCS) suitable for automotive applications and the cost-efficient direct copper bonded (DCB) Al2O3 substrates suitable for applications with lower requirements. The cost-reduction of the condura®.ultra process is achieved by using a silver free brazing technology combined with an efficient brazing process. Within this report we will demonstrate the thermal cycling capability, the peel strength of the condura®.ultra process combined with a design to cost Si3N4 ceramic substrate. Additionally showing results regarding isolation partial discharge of performance and robustness in thermal resistance measurements.
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