Abstract
SUMMARYA stacked‐type chain PRAM that can result in lower cost than flash memory has been proposed. The newly proposed memory cell uses a PCM for data storage and an MOS transistor connected in parallel. This memory cell is connected in series to realize the chain structure. The cell structure, the design method for realizing stable read and write operation, and the core circuit for the stacked‐type chain PRAM are described. The newly proposed memory cell has been designed to use BiCS (Bit Cost Scalable) process technology in order to achieve low‐cost memory. The design of the resistance of the PCM and the pass transistor is a key issue for realizing stable operation. To design the row decoder, the circuit concept of stacked ferroelectric RAM (FeRAM) with an NAND structure cell has been successfully adopted with SGT. The newly proposed stacked‐type chain PRAM is a promising candidate for realizing high‐speed and low‐power future nonvolatile semiconductor memory.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
