Design and Analysis of Various Non-radiating Transmission Line Structures on a High-Speed PCBs

Abstract

AbstractPrimary challenge in high-speed modern electronic designs is to maintain good signal integrity in the presence of intersymbol interference and crosstalk. Crosstalk is identified as one of the major factors which influence signal integrity on the printed circuit boards (PCBs). The main idea of this effort is to understand the interference between two non-radiating conductor transmission lines. Conventionally spaces between the traces are increased by means of introducing guard traces introduced to reduce crosstalk and to ensure signal integrity. Present concern is to design and evaluate non-radiating transmission line performance by changing the structure and parameters of the signal carrying transmission lines with minimal spacing between traces. To numerically analyse the best non-radiating conductor transmission lines, circuit simulation tool, Advanced System Design (ADS), is used. The simulated structural design is experimentally analysed and tested at double data rate (DDR) – 3 to 4 GHz, where its experimental results is compared with simulated result and tabulated. The best non-radiating structure is further analysed for crosstalk estimation on account of eye pattern, where the intersymbol interference is analysed for crosstalk estimation. Numerical solving of these non-radiating transmission lines is carried out with the digital transmission system with the date rate of 5G bits, and the eye diagram improves, which means that the method achieves better crosstalk cancelling effect, and implementation of it in multi-conductor transmission lines (MTLs) on PCBs is further recommended.KeywordsSignal integrityMulti-conductor transmission line (MTL)CrosstalkIntersymbol interferenceNear-field crosstalk (NXT)Far-field crosstalk (FXT)