Abstract
There has been a growing interest in depositing metal-containing thin films by plasma polymerization for various applications. These films have been deposited by two methods (a) by plasma polymerization of volatile organometallic monomers, and (b) by simultaneous plasma etching and polymerization in the same system, resulting in metal-containing fluoropolymers. Heretofore, most films so deposited have had low metal to carbon ratios and are insulating in nature. In our laboratories, we have been working on the plasma polymerization of volatile organometallic monomers with an aim to producing conducting films. We have observed that there is a critical threshold value of metal to carbon composition above which the films become electrically conductive. The key to depositing films having higher metal to carbon ratios is the plasma conditions. In this paper, we will review the work in our laboratories on plasma polymerization of organometallic monomers and discuss the preparation and properties of organotin monomers with various tin to carbon ratios. We will also discuss some of our recent results on plasma polymerization of an organoiron monomer. These films have been characterized by ESCA, IR, SEM, TEM, and x-ray diffractograms.
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More From: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
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