Deposition characteristics and influence regularity of sputtered products in a low-power RF gridded ion thruster

Abstract

RF ion thruster has a broad prospect of development via its simple structure, high specific impulse and electrode-less discharge. During the RF operating process, an important but ignored generally issue is that the high-energy metal particles generated by sputtering grid system can diffuse towards the ionization chamber and then deposit on the wall to form a conductive film. As a result, the RF power feed can be significantly inhibited which affects the thruster perform and reliability. In this work, the axial distribution of film thickness on the ionization chamber has been measured which has the characteristic of nonlinear distribution. And the film roughness can be significantly affected due to the gradient of film thickness and deposition temperature. Another corresponding measurement of plasma parameter evolutions in the ionization chamber has been carried out within 6000 min of thruster operation. Results shows that the presence of the deposited film can result in a ∼30 % decrease in the plasma density, which weakens the grid sputtering erosion and subsequently leads to a decrease in film growth rate. The combination of contributed to the degradation of the thruster performance, with the effect of deposited film accounting for about 41 %.