Abstract
By systematically varying the boron concentration near the oxide/4H–SiC interface within a specifically designed boron-diffusion layer oxide structure, this paper explores the influence of boron concentration on interface state density and near-interface trap density in 4H–SiC MOS capacitors. Additionally, the effect of boron near the oxide/4H–SiC interface on device stability under elevated temperature conditions was examined. The boron species were introduced into the SiO2/4H–SiC interface by spin coating followed by annealing, whose temperature controls the amount of boron present in the near interface region. It is suggested that a higher concentration of boron leads to a better trap passivation effect while preserving the stability of flat band voltage.
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