Abstract

The dependencies of the electrical characteristics of n-metal–oxide–semiconductor field-effect transistors (n-MOSFETs) on the nano-scale Si thickness (<20 nm) and Ge concentration for unstrained Si grown on strained SiGe-on-insulator were investigated. As the Si thickness decreased, the electron mobility decreased more significantly than the strained Si n-MOSFET grown on relaxed SiGe-on-insulator (SGOI). In addition, the electron mobility decreased with increasing the Ge concentration, contrary to strained Si SGOI n-MOSFET.

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