Abstract
The deposition behavior of copper particles during the aerosol deposition (AD) process was predicted according to the particle velocity via a numerical model. Plastic deformation of Cu particles was predicted by a cumulative effect among the injected carrier gas consumption, particle velocity, internal energy, compressive strain, and heat-induced thermal softening of the particle. Besides, there is possibility on oxidation of copper, which is influence on increase of electrical resistivity, caused by the induced heat. To compare the simulation results and understand the actual deposition behavior of Cu particles, Cu films were fabricated through AD using subdivided gas consumptions. The microstructure was confirmed by both the plastic strain through the Williamson–Hall plot and the strain results by the simulation. From the simulation and X-ray analysis, the characteristic of induced heat was analyzed to demonstrate the influence on oxidation, and to obtain suitable AD condition for low resistivity of Cu film.
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