Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

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In this study, experimental works are performed to investigate the deformation mechanism and electrical reliability of the anisotropic conductive adhesive film (ACF) joint subjected to temperature cycling for flip chip on organic board (FCOB) assemblies. This paper presents some dominant deformation parameters governing the electrical degradation in an ACF joint between a chip and a substrate when flip chip assembly is heated and cooled. The deformation mechanism of ACF flip chip assemblies during the temperature cycling are investigated using in situ high sensitivity moiré interferometry. A four-point probe method is conducted to measure the real-time contact resistance of ACF joint subjected to the cyclic temperature variation. As the temperature increases below T g of ACF, the bending displacement of assembly decreases linearly. At the temperature higher than T g of ACF, there is no further change in bending behavior and in-plane deformations of a chip and a substrate become approximately free thermal expansion. It is because that soft-rubbery ACF at the temperature above T g cannot provide the mechanical coupling between a chip and a substrate. The effect of bump location on the temperature dependent contact resistance is evident. A characteristic hysteresis in bending curves is observed and discussed. The contact resistance of the corner bumps increases with increasing temperature at a higher rate when compared to that of the middle. Failure analysis is performed to examine the ACF interconnections before and after thermal cycling test. The results indicate that during the thermal loading, the shear deformation is more detrimental to the electrical degradation of ACF joints than normal strain.