Abstract
During the cathodic arc enhanced metal ion etching process of steel substrates droplets are generated on the cathode which deposit on the substrate surface. The concentration of the droplets obviously depends upon the melting point of the target material. The number of droplets is much greater for TiAl than for Ti. The composition of the TiAl droplets also depends on their size. Large droplets tend to have the same composition as the target material, whereas smaller droplets are enriched in Ti. The adhesion of the droplets to the substrate is very poor, certainly below L c = 20 N. A subsequent coating of the droplet contaminated surface with the unbalanced magnetron leads to growth defects. Nodule-like defects continue to form on the droplet itself, whereas other droplets are expelled from the coating surface during film growth, generating craters and dish-like growth defects. A simple explanation for the self-expulsion mechanism of droplets is given.
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