Abstract

The purpose of this paper is to present a methodology for the evaluation of the Defect Level in an IC design environment. The methodology is based on the extension of Williams-Brown formula to nonequiprobable faults, which are collected from the IC layout, using the information on a typical IC process line defect statistics. The concept of weighted fault coverage is introduced, and the Defect Level (DL) evaluated for the Poisson and the negative binomial yield models. It is shown that DL depends on the critical areas associated with undetected faults, and their correspondent defect densities. Simulation results are presented, which highlight that the classic single Line Stuck-At (LSA) fault coverage is a unreliable metric of test quality. Moreover, results show that the efficiency of a given set of test patterns strongly depends on the physical design and defect statistics.

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