Abstract
A new kind of carborane-containing aromatic diamine, 1,2-bis (4-aminophenyl)-1,2-dicarba-closo-dodecaborane (HPPA), as a curing agent for epoxy resins was synthesized and confirmed by proton, carbon and boron nuclear magnetic resonance imaging, Fourier transform infrared spectroscopy and elemental analysis. The compatibility, thermal curing behaviour and thermal properties of HPPA/epoxy resin E51 system were investigated. HPPA exhibited good compatibility with E51. Compared with 4,4′-diaminodiphenylsulphone (DDS)/E51, HPPA/E51 system had higher reaction activity and lower curing temperature. When the ratio of amine protons versus epoxy groups was 1:1 in resin systems, the epoxy resin cured by HPPA exhibited the highest glass transition temperature of 207°C. The residual weight ratios of cured HPPA/E51 at 800°C under argon and in air atmospheres were 43.7% and 50.5%, respectively, which were 28.6% and 47.2% higher than that of DDS/E51, respectively, indicating that the HPPA/E51 system had good heat resistance.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
