Effect of hydroxylated boron nitride and boron nitride nanosheets on the properties of doped organosilicone rubber composites

Abstract

As the electronic industry develops rapidly, the miniaturisation, integration and multifunctionality of electronic devices have resulted in a dramatic increase in power density, and the heat dispersal of electronic devices has attracted much attention. In this work, hydroxylated hexagonal boron nitride (BN-H) was obtained by hot alkali treatment, and boron nitride nanosheets (BNNS) with a thickness of about 4 nm were obtained by boric acid-assisted ball milling stripping. The effects of different types of fillers as well as filler contents on the thermally conductive and mechanical performance of organosilicon composites were also compared. Notably, when BN-H and BNNS thermally conductive fillers were added at 12 wt%, the thermally conductive coefficients of the composites were 0.4831 W·m−1·K−1 and 0.7131 W·m−1 K−1, respectively, which were 183% and 318% of higher than that for the pure silicone rubber (SR, with a thermally conductive coefficient of 0.1706 W·m−1·K−1). In addition, in respect of mechanical performance, the tensile strengths of SR/BN-H and SR/BNNS composites with a filling level of 12 wt% were 3.59 MPa and 3.89 MPa, respectively, and the storage moduli were 4501 MPa and 4583 MPa, respectively, which were improved to a certain extent compared with pure SR. The present work provides an effective way to develop organosilicone rubber composites with good thermal conductivity and mechanical properties by boric acid assisted ball milling to strip boron nitride in the field of electronics packages.