Abstract

Tetrabromobisphenol A epoxy resin is widely used in the electronics and aerospace industries, but application is limited due to high costs. The aim of this study was to determine the effects of lignin and brominated lignin on thermal properties of epoxy resin. Lignin and brominated lignin were mixed with bisphenol A and reacted with epichlorohydrin to produce epoxy resin. Then, thermal properties of the epoxy resin were tested. Results showed that when the lignin content (M:M) was 10%, temperatures for mass loss were higher than that of bisphenol A epoxy resin (the initial temperature was 4.4℃ higher and the peak temperature was 68.9℃ higher), and the mass loss was 3.8% lower. Temperatures for mass loss of brominated lignin-bisphenol A epoxy resin (Br-LBEP) were higher than that of LBEP (initial temperature 112.2℃ higher and peak temperature 93.7℃ higher) with the mass loss being 2.1% lower. Thus, brominated lignin improved thermal properties and could be used instead of tetrabromobisphenol A to produce high thermal property epoxy resin.

Full Text
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