Abstract
With the goal of enabling high-power-density cryogenic power converter technology and superconducting power applications for future aircraft and shipboard power systems, the dynamic and static performances of a press-pack IGBT module (T0160NB45A) at ambient and cryogenic conditions are reported. Compared to the wire-bond IGBT’s, press-pack IGBT’s are more suitable for cryogenic conditions as they do not have bonded connections and use fewer materials types, which reduces the risk of coefficient of thermal expansion (CTE) mismatch. The study has been conducted with a cryogenic testbed that provides a condensation-free condition during and after tests, which is essential for the preservation of the physical properties of IGBT’s being tested. The dynamic performance characterization results show that the switching speeds of both turn-on and turn-off are improved with substantially reduced tail current and increased dv/dt at cryogenic conditions. Moreover, the static performance characterization results show a reduction in collector-emitter voltage drop, indicating higher conductivity of the IGBT at cryogenic conditions. Furthermore, the impact of clamping force and gate lead length on the press-pack IGBT’s dynamic characteristics is reported. The findings of this study suggest that press-pack IGBT modules are suitable for cryogenic operation.
Highlights
One of the promising candidate technologies that is essential for the materialization of high-powerdensity power systems for future aircraft and shipboard applications is the superconductor technology
The cryogenic and ambient sections are electrically connected by three conductor rods that are connected to the DC-link capacitors and the stack of IGBT modules
The three rods were fastened to a custom design nylon bushing mounted on the bottom plate of the ambient section via collar clamps, and the IGBT and the inductor were connected at the bottom of the rods
Summary
One of the promising candidate technologies that is essential for the materialization of high-powerdensity power systems for future aircraft and shipboard applications is the superconductor technology. Capacitors, and inductors are the key current-carrying components constituting any power electronics. One of the ways of avoiding all of these challenges is by operating the power converter at ambient conditions while the rest of the system components are operated at cryogenic conditions. Since such solution is not ideal for maximizing the overall system efficiency, cryogenic compatible power electronics devices need to be developed for the materialization of a fully cryogenically operating power system that provides maximum thermal and system efficiency.
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