Abstract
The press-pack IGBT (PPI) modules are characterized by design of double-sided cooling, solderless joint and wire-bondless contact. These features allows them to be utilized in the field where power density and reliability are demanding, especially in multi-MW wind turbine applications. However, owing to the press-pack structure, there is parasitic inductance which can't be neglected in the mechanical assembly with PPI modules. To diminish the voltage overshoot during turn-off transition caused by the parasitic inductance, an advanced active gate driver is put forward in this paper. The control diagram is given and the feasibility is evaluated. Eventually the performance between passive gate driver and proposed solution is compared experimentally.
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