Abstract
Over the last decade, due to requirements of high speed performance and small form factor, signal integrity becomes a significant portion of package design effort. Especially, crosstalk analysis among interconnects in high density and fine pitch packages has become critical for optimized design of signal interconnects. This paper discusses crosstalk analysis among interconnection structures fabricated on silicon interposer. Two kinds of structures are considered. One is the transmission lines fabricated on redistribution layers; the other is TSV (through silicon via) arrays. Through crosstalk analysis, we roughly evaluated the coupling property of some specified interconnection structures and proposed several optimized structures to reduce crosstalk.
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