Abstract
Creep properties of cold weld polycrystalline Al (metal)-Cu50Zr50 (metallic glass) specimens are investigated by molecular dynamics (MD) simulations. The EAM (Embedded Atom Method) potential is used for modelling the interactions between Al, Cu and Zr atoms. Cold welding is carried out at a velocity of 30 m/s and interference (contact time) of 1.3 nm. The Creep behavior study of welded sample is carried out at different range of stress (100 MPa–500 MPa) and temperatures (100 K–500 K) for analysing the effect of stress and temperature on creep behavior. The creep curve shows very short primary creep and significant steady-state creep. Also with an increase in temperature or stress the steady-state creep rate increases. At lower temperature (100 K) the creep deformation mechanism is by dislocation slip and at a higher temperature (500 K) and higher stress (500 MPa) it is by diffusion. The stress exponent ‘n’ has two values, at lower stress n = 1.56 and at higher stress n = 5.82 respectively.
Published Version
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