Abstract
A detailed analysis of the creep behavior of copper in the intermediate temperature regime between 0.46–0.72 Tm of the absolute melting point is presented. Several possible creep mechanisms are considered, and it is concluded that high temperature climb is dominant in the power-law creep region, while obstacle-controlled glide occurring within the cell interiors is rate-controlling in the exponential creep regime. A phenomenological model is proposed which assumes that cell boundaries within subgrains act as sources and obstacles to gliding dislocations. Dislocation annihilation is assumed to occur at the cell boundaries by climb and cross-slip. The implications of these results on the transition from power-law to exponential creep are examined.
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