Abstract
Tellurium (Te), an emerging semiconductor material, exhibits intriguing physical properties in low-dimensional forms. This study investigates the structural, morphological, and transport properties of low-dimensional Te thin film deposited by physical vapor deposition after 400 keV Kr2+ ion irradiation with varying fluences of 1 × 1013, 5 × 1013, and1 × 1014 ions-cm−2. The X-ray diffraction (XRD) pattern reveals the hexagonal phase of pristine Te. As ion fluence increases, intensity of the XRD peaks decreases and the full-width half maxima (FWHM) increases, indicating a reduction in crystallinity. The intensity of the Raman peak decreases upon irradiation, resulting in a red shift in the spectra of the irradiated sample. The evolution of morphology at different fluences has been examined with atomic force microscopy (AFM) measurements. The results indicate the segregation of grains and an increase in root mean square (RMS) roughness from 2.59 pm to 5.11 pm with ion fluence up to 5 × 1013 ions-cm−2. At the highest fluence, i.e., 1 × 1014 ions-cm−2, there is an agglomeration of grains, and hence a decrease in RMS roughness to 3.92 pm is observed. The DC resistivity measurement indicates the semiconducting nature of all films. Additionally, this measurement signifies the rapid decrease in activation energy at both band-to-band conduction and nearest neighbour hopping (NNH) conduction. Following irradiation, Hall measurement demonstrates a decrease in the concentration of charge carriers and an increase in resistivity due to scattering originating from grain boundaries. However, when the fluence is increased to 1 × 1014 ions-cm−2, there is a reduction in resistivity and an increase in carrier concentration with enhanced Hall mobility in comparison to pristine Te. Therefore, this study showcases that low-energy ion irradiation has a significant impact on the modification of the structure, morphology, and electrical transport properties of semiconducting Te thin film.
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