Abstract
Co-precipitation of copper and nickel in silicon bicrystals produced by wafer-bonding has been investigated. Transmission electron microscopy and energy-dispersive X-ray analysis show two types of precipitates: copper-rich silicide particles that contain a small partial mole fraction of 5% of nickel and nickel-rich particles containing a partial mole fraction between 15% and 25% of copper. Both types of precipitates are found inside large precipitate colonies typical for copper precipitation in silicon in the absence of nickel co-doping. Thermodynamically these precipitates can be assigned to the known binary metal silicide phases Cu 3Si and NiSi 2 and a solid solution of a second metal species therein.
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