Copper Thick Film—A Maturing Technology

Abstract

Knowledge of critical materials and process parameters necessary to fabricate quality copper thick film multilayer and hybrid circuits is being amassed and distributed throughout the industry via technical reports and presentations. Generally the information being provided in a single report deals with specific segments of the industry or only one or two specific nitrogen fireable materials. In order for hybrid manufacturers to commit themselves to the technology they need to know that sufficient flexibility exists to permit design of complex circuits and accommodate circuit design changes without imposing changes in basic process guidelines and controls. The OEM's concern, which is valid, has been that the investment required for capital equipment and establishing new processes must be fully supported by and provide reasonable return from the technology being initiated. This paper introduces new information on wire bonding in copper thick film circuits and some improvements in nitrogen fireable resistor characteristics and processing. Materials are available to produce a broad range of circuits without varying basic process parameters, and adding wirebonding as an interconnect capability further expands the circuit complexity and density achievable with copper thick films.