Abstract
Some new no-clean fluxes were investigated by measurement of ionic contamination of flux residues and influence of flux residues on surface insulation resistance (SIR) and electromigration (EM) between soldered conductors. Also copper corrosion test in the humidity chamber was performed on samples with fluxes investigated. The results of SIR, EM and copper corrosion tests were compared on test samples prepared as printed circuits and hybrid circuits.
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