Abstract

In this paper a case study of the introduction of European environmental regulations on the restriction of the use of substances (RoHS) in thick-film hybrid technology is presented. The hazardous materials in thick-film hybrid circuits can be found mainly in the solder for soldering SMD components and in the thick-film materials. The substitution of hazardous materials with acceptable alternatives is possible with lead-free soldering technology and with the new, emerging thick-film pastes. But using the new materials and a modified manufacturing process require research and an assessment of the reliability of the new green hybrid circuits in comparison with the conventional ones. As a case study the authors designed a thick-film hybrid circuit that was produced using ecologically friendly as well as conventional materials. The circuits were aged under accelerated conditions, including temperature cycling and humidity testing. The measured functional characteristics of both sets of samples before and after ageing show that a humidity/temperature test at 93%RH/+40degC up to 1000 hours has no significant influence on the circuits' characteristics. On the other hand, failure rates after 1000 temperature cycles (-40/+125degC) are rather high - especially for some combinations of thick-film conductor materials and solders used for soldering discrete SMD electronic components

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