Abstract
The solder tests currently used in defining solder alloy properties are not sufficient for selecting interconnect materials for improved reliability and reduced cost in automotive electronic applications. A “preventive” design approach based upon more accurate models of failure mechanisms and life prediction than are currently available will be required in order to assess solder alloys and to determine whether lead-free solders will provide improved reliability and lower-cost manufacturing options when compared to the lead-based solders currently used.
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