A Review of TiO2-nanoparticle Reinforced Lead-Free Solder Composites Used in Electronic Components Soldering

Abstract

Lead-free solder alloys have become popular and largely adopted as an alternative to lead-based solder alloys in the soldering of electronic components and electronic packaging. Ever since the legislation on end-of-life disposal and the European Union׳s (EU) Restriction of Hazardous Substances (RoHS) directive has led to the elimination of lead-based solder and made Sn-Ag-Cu eutectic and Sn-Cu eutectic acceptable alternative. However, researchers continue their endeavor to find more reliable and less expensive alternatives. Recently, several additives prove to enhance the solder properties and these composites are capturing attention especially for Sn-based lead-free solder. The addition of nanoparticles into Sn-based solder alloys improves the solder joint strength, refine the intermetallic compound (IMC), suppresses the IMC growth, and increases the matrix strength and joint reliability. Several other superior attributes can be achieved by adding nanoparticles into solder alloys. This paper particularly reviews the effect of TiO2 nanoparticles on a lead-free Sn-based solder system.