Abstract
A ripening and growing method of Sn and Bi nanoseeds mixture was developed to synthesize the Sn–Bi alloy microspheres (Sn–Bi MSs) with adjustable diameter. Which played a vital role in bonding the Cu and Sn MSs fillers of ternary composite solder. Through careful investigations of the relationship between soldering performances and the proportion of different filler, the optimal conductivity (ρ = 19.0 μΩ cm), bending strength (162.0 MPa) and peeling strength (9.8 N cm−1) were obtained. Meanwhile, the work temperature has been raised about 130 °C by the transform of low-melting Sn–Bi to high-melting intermetallic compounds (IMCs) during soldering process. The balance mechanisms of soldering quality and fillers properties have been unraveled and validated. This work suggests a new pathway toward the improvements of performance and high-temperature stability of lead-free Sn–Bi solder, which could be widely applied in the microelectronic and semiconductor packaging.
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