Abstract
A novel Sn–Bi composite solder reinforced by nanosized graphite was studied. Effect of nanosized graphite content on spreadability was studied by spreading test. Microstructure of Sn–Bi solder and Sn–Bi composite solder was observed by scanning electron microscope. The tensile test and creep test for Sn–Bi solder and Sn–Bi composite solder joints were conducted in a micro-mechanical test system. The results show that the addition of nanosized graphite is harmful to the spreadability of Sn–Bi solder. The microstructure of Sn–Bi composite solder is refined gradually with the content of graphite increased. The ultimate tensile strength of Sn–Bi composite solders joints is reduced with the addition of nanosized graphite and the ultimate tensile strength of Sn–Bi + 0.07 wt% solder joint is almost unchanged compared with Sn–Bi solder joint. There is a great improvement in elongation of Sn–Bi + 0.07 wt% graphite solder joint. Furthermore, Sn–Bi + 0.07 wt% composite solder has a better creep performance compared with Sn–Bi solder.
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