Concurrent optimization of MDP, mask writing, and mask inspection for mask manufacturing cost reduction

Abstract

As the feature size of LSI shrinks the cost of mask manufacturing and turn-around-time (TAT) continues to increase. These increases are reaching to points of great concerns. Association of Super-Advanced Electronics Technologies (ASET) Mask Design, Drawing, and Inspection Technology Research Department (Mask D2I) launched a 4-year program for reducing mask manufacturing cost and TAT by concurrent optimization of MDP, mask writing, and mask inspection that involves exploitation of close relationships and synergism among them. The task will be accomplished by sharing four key avenues: a) common data format, b) clever use of repeating patterns, c) pattern prioritization based on design intent, and d) parallel processing. Under the concurrent optimization scheme, mask pattern priorities that we call as Mask Data Rank (MDR) are extracted from the design side, and repeating patterns are extracted from mask pattern data. These are fed-forward to mask writing and mask inspection sides. In mask writing, MDR is employed to optimize the writing conditions; and in Character Projection (CP) writing, repeating patterns are utilized for that purpose. In mask inspection, MDR is used to optimize defect judgment conditions, and repeating patterns are utilized for efficient review. For mask writing, we are developing a parallel e-beam writing system Multi Column Cell (MCC). Furthermore, we are developing an integrated diagnostic system for e-beam mask writer, and a technology for defect judgment technology based on defect printability in mask inspection. In this paper we describe details of our activity, its status, and some recent results.