Abstract
In the present study, the effect of four oxide ceramics (TiO2, ZnO, ZrO2, and CuO) as reinforcements were investigated on the soldering parameters of the SAC 0307 solder alloy. The oxide ceramics were used in nano-powder format. Composite solder pastes were composed by the standard ball milling process of the nano-particles into the SAC 0307 solder paste in 0.25wt% weight fraction. The wettability, shear strength, and microstructure of the composite solder joints were studied and compared. The ceramic nano-particles did not have a major effect on the wettability of the solder. Shear strength increases were observed at the composite joints, except in the case of ZnO. Generally, Sn grain refinement was found in the Sn-matrix which could be the reason for the shear strength increase.
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