Abstract
The reason for chip embedding by means of PCB technology are manifold. Actually there are several emerging technologies on the market which all face one common problem: To realize the escape routing of a high pin count die one has to use several build up layers or very fine lines & spaces for the PCB. Both approaches have a significant influence on the cost of a electrical component because both solutions raise the manufacturing complexity. Due to this problem approaches like “chip first” or “chip last” are being discussed in plenty of papers. With this paper, an alternative way of producing embedded systems is mentioned, which overcomes many of the actual problems.
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