Abstract
The chip carrier package is gaining acceptance as a largescale integration (LSI) and very large-scale integration (VLSI) circuit package which can be integrated with medium-scale integration (MSI), small-scale integration (SSI), and passive components onto conventional printed wiring boards. In addition, the chip carrier package is being used to manufacture high density small modules which can be used as stand-alone functions or interfaced with conventional printed circuit boards as modular building blocks. In manufacturing high density small ceramic modules with devices in chip carriers, a soft assembly and test approach has been found to be useful during the start-up phase of a new product.
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