Abstract
This paper gives an overview on some state-of-the-art characterization methods of SiO2/4H-SiC interfaces in metal oxide semiconductor field effect transistors (MOSFETs). In particular, the work compares the benefits and drawbacks of different techniques to assess the physical parameters describing the electronic properties and the current transport at the SiO2/SiC interfaces (interface states, channel mobility, trapping phenomena, etc.). First, the most common electrical characterization techniques of SiO2/SiC interfaces are presented (e.g., capacitance- and current-voltage techniques, transient capacitance, and current measurements). Then, examples of electrical characterizations at the nanoscale (by scanning probe microscopy techniques) are given, to get insights on the homogeneity of the SiO2/SiC interface and the local interfacial doping effects occurring upon annealing. The trapping effects occurring in SiO2/4H-SiC MOS systems are elucidated using advanced capacitance and current measurements as a function of time. In particular, these measurements give information on the density (~1011 cm−2) of near interface oxide traps (NIOTs) present inside the SiO2 layer and their position with respect to the interface with SiC (at about 1–2 nm). Finally, it will be shown that a comparison of the electrical data with advanced structural and chemical characterization methods makes it possible to ascribe the NIOTs to the presence of a sub-stoichiometric SiOx layer at the interface.
Highlights
Silicon carbide (4H-SiC) is the best candidate to replace silicon in power electronics applications.In particular, its high critical electric field and large band gap make it possible to design devices with a high breakdown voltage (BV), having specific on-resistance (Ron,sp ) two orders of magnitude lower than silicon-powered devices
The Ron,sp versus BV plot shows that planar metal oxide semiconductor field effect transistors (MOSFETs) have approached the 4H-SiC unipolar limit for BV values larger than 1200 V
Rozen et al [28] reported a correlation between the MOSFET channel mobility, the amount of nitrogen incorporated at the SiO2 /4H-SiC interface upon annealing in NO, and the interface charged states Nit
Summary
Silicon carbide (4H-SiC) is the best candidate to replace silicon in power electronics applications. Its high critical electric field and large band gap make it possible to design devices with a high breakdown voltage (BV), having specific on-resistance (Ron,sp ) two orders of magnitude lower than silicon-powered devices. The Ron,sp versus BV plot shows that planar metal oxide semiconductor field effect transistors (MOSFETs) have approached the 4H-SiC unipolar limit for BV values larger than 1200 V Both the commercial and the R&D devices designed for operating in the 600–900 V range [1,2] are still far from the ideal unipolar limit.
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