Abstract
With the continuous development of electronic devices, effective heat dissipation has become a major factor affecting service life. Thermal interface materials (TIM) play a key role in controlling heat dissipation of electronic devices and have thus attracted widespread attention. In this study, we used graphene flakes (GF) derived from graphene film that is wasted during the preparation of commercial large-scale graphene-enhanced TIMs as thermally conductive fillers to formulate a new TIM. The thermal conductivity of the developed TIM is 50% higher with GFs than without. Furthermore, the TIM has a tensile strength of 0.46 MPa with an elongation at break of 1225%, a maximum compression strength of 0.64 MPa at 50% compression, and high mechanical cycle stability. This report provides a cost-efficient and environmentally friendly approach to producing high-performance TIMs for electronic cooling applications.
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