Characteristics of high-k gate oxide prepared by oxidation of multi-layered Hf/Zr/Hf/Zr/Hf metal films

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We investigated the physical and electrical properties of Hf–Zr mixed high-k oxide films obtained by the oxidation and annealing of multi-layered metal films (i.e., Hf/Zr/Hf/Zr/Hf, ∼5 nm). We demonstrated that the oxidation of multi-layered metal films results in two distinctive amorphous layers: That is, Hf–Zr mixed oxide film was formed on the top of silicate film due to inter-diffusion between Hf and Zr layer. This film shows the improved dielectric constant (k) and the raised crystallization temperature. Compared with HfO2 and ZrO2 gate dielectric, the crystallization temperature of Hf–Zr mixed oxides was raised by more than 200 °C. Using AES and XPS, we observed that Zr oxide has more fully oxidized stoichiometry than Hf oxide, irrespective of annealing temperatures. We also found that the thickness of an interfacial layer located between Hf–Zr mixed oxide and Si substrate also increases as annealing temperature increases. Especially, the thin SiOx interfacial layer starts to form if annealing temperature increases over 700 °C, deteriorating the equivalent oxide thickness.