Abstract
The feasibility of using a thick ground plane with an aperture coupled microstrip patch antenna while maintaining reasonable antenna performance is demonstrated using moment method and reciprocity analyses in the spectral domain. The thick ground plane, which may serve as a heatsink for active MMIC circuitry, or as a mechanical support for thin substrates, is particularly advantageous in millimetre wave phased array applications. It is found that the effect of ground plane thickness is to reduce the level of coupling from the feed line to the patch.
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