Abstract
A thick ground plane for a slot-coupled microstrip antenna is proposed as a support and as a heat sink for an MMIC installed on the back plane of the active array antenna. The influence of a thick metal ground plane has been investigated in detail. Both measured and calculated results of VSWR and the calculated back lobe are shown in detail. The calculated results agree well with the measurements. It is made clear that the thickness of the ground plane can be extended to five times that of the antenna substrate while maintaining the antenna performance. Results are applicable to the practical design of an integrated antenna at millimeter wave frequencies with an MMIC.
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