Abstract
Electrodeposition of soft gold is an important process in the fabrication of micro devices for electronics, optics etc. Traditional gold electroplating is based on a gold cyanide process which is not applicable for the stringent requirements in state of the art micro device manufacture. Newcastle University has been involved in the development of an industrial process based on a mixed ligand electrolyte—the gold thiosulphate–sulphite system. Here we present methods for the formulation of this electrolyte in the laboratory which ensure bath stability and process compatibility. In addition, we have carried out spectrophotometry to elucidate the possible reasons of its chemical stability. Standard rotating disk and cyclic voltammetry has been carried out to determine the electrochemical behaviour of the gold thiosulphate–sulphite system. The changes in electrochemical behaviour as the bath ages are also discussed.
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