Abstract
The behavior of power supply noise depends strongly on the design of the power distribution network. The issues of power delivery for three-dimensional (3-D) circuits are discussed in this chapter. Integrating the power delivery components into one tier within the 3-D stack allows smaller currents to propagate through the overall power distribution system, decreasing the power supply noise. The role of the vertical interconnects in distributing power and ground within a 3-D stack is discussed. Different approaches for distributing the decoupling capacitance throughout a multitier stack are coherently treated with the distribution of the through silicon vias to ensure that specific power noise constraints are satisfied.
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