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Abstract
This chapter discusses the lithography considerations prior to wafer processing, including layout design such as the rules concerning minimum lines and spaces, required overlaps, recommended and/or forbidden shapes. The selection of the required photoresists for different applications is discussed. The process sequence of wafer lithography is described. The various applications of thick resists are covered briefly. In addition, optical lithography with photomasks and other, more niche, patterning techniques are also discussed.
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