Abstract
Integration of the three materials: silicon, metal, and carbon in a variety of nanostructured architectures promise synergetic functionalities that afford future novel technologies and applications. This chapter first discusses the integration of gold and silicon in particular and metal and silicon in general. It introduces the eutectic-alloy effect of low-melting temperatures and novel direct phase transition, along with applications, including soldering and bonding, synthesis of Si nanowires and nanopillars and nanoparticles, as well as gold nano wires/rods. Silicon-metal/oxide core shell architectures are also discussed. Progress in the integration of carbon nanostructures (nanotubes and graphene etc.) in silicon CMOS and waveguides, as well as in metal are presented.
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