Abstract
The electrical resistances of titanium evaporated films with a thickness of about 100 Å were measured after exposure to oxygen. Increases in the resistance up to an oxygen exposure of 10L follow a nearly straight line, but the increases become smaller as the Tempax glass (borosilicate glass) substrate temperature during titanium evaporation rises. This is thought to be caused by the difference in grain size of the films. A diffusion model of the phenomena is given. Auger electron appearance potential spectra, which give information about chemical bondings, show no evidence of the existence of any stable compounds in the films.
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