Abstract
Abstract This study investigates how trap charges in the back oxide layer affect the memory performance of 3D NAND flash memory. We used TCAD to simulate the effect on cell reliability, focusing on retention and interference characteristics, based on changes in current paths and program speed as initial cell characteristics. Additionally, we applied these findings to various channel structures — planar, concave, and convex — that can occur in 3D NAND. Our results indicate that the optimal trap charge for enhancing cell performance lies between -10¹¹ and -10¹⁰ /cm³ and should not exceed -1011 /cm3. Through this research, we can expect the potential for effectively inserting trap charges in actual manufacturing processes to improve the performance characteristics of 3D NAND cells.
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