Abstract

We demonstrate broadband and wide-angle antireflective surface nanostructuring in GaAs semiconductors using variable dose electron-beam lithography (EBL). Various designed structures are written with EBL on a positive EB-resist coated GaAs and developed followed by shallow inductively coupled plasma etching. An optimized nanostructured surface shows a reduced surface reflectivity down to less than 2.5% in the visible range of 450–700 nm and an average reflectance of less than 4% over a broad near-infrared wavelength range from 900–1400 nm. The results are obtained over a wide incidence angle of 33.3°. This study shows the potential for anti-reflective structures using a simpler reverse EBL process which can provide optical absorption or extraction efficiency enhancement in semiconductors relevant to improved performance in solar photovoltaics or light-emitting diodes.

Highlights

  • Nanostructured GaAs with variable electron-beam lithography (EBL) exposure dosesThis simulation study indicates that surface patterning in GaAs has drastically reduced the surface reflections and increases the total optical absorption power (83%) in the GaAs substrate over a broad wavelength range (450–700 nm) and the maximum power absorbed through the volume of the substrate is 6.8 × 1020 Wm−3

  • We demonstrate broadband and wide-angle antireflective surface nanostructuring in GaAs semiconductors using variable dose electron-beam lithography (EBL)

  • This study shows the potential for anti-reflective structures using a simpler reverse EBL process which can provide optical absorption or extraction efficiency enhancement in semiconductors relevant to improved performance in solar photovoltaics or light-emitting diodes

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Summary

Nanostructured GaAs with variable EBL exposure doses

This simulation study indicates that surface patterning in GaAs has drastically reduced the surface reflections and increases the total optical absorption power (83%) in the GaAs substrate over a broad wavelength range (450–700 nm) and the maximum power absorbed through the volume of the substrate is 6.8 × 1020 Wm−3. This texturing can find application in efficiency enhancement in solar photovoltaics towards broad-spectrum solar energy harvesting

Methods
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