Abstract

We demonstrate that epitaxial growth temperatures can be lowered by in situ boron incorporation using rapid thermal processing chemical vapor deposition (RTPCVD). Heavily boron-doped epitaxial layers with very abrupt dopant transition profiles have been grown at 800 °C. Carrier concentrations as high as 5×1019 cm−3 were obtained with defect densities of the order of 102–103 cm−2. The film quality and surface morphology were closely related to dopant concentration. Higher dopant concentrations improved surface morphology.

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