Abstract

A nano-scale bonding process using a multi-wall carbon nanotube (CNT) has been successfully applied in a scanning electron microscope (SEM)/scanning tunneling microscope (STM) combined system. Under the SEM observation, a Ti-coated STM tip was approached onto a CNT bridging Ti pads, which is patterned with a 4 µm gap on a SiO2 surface, to investigate the conduction property of the CNT. A voltage pulse of 12 V peak and 50 µs duration was applied in order to deposit Ti clusters onto the CNT, which is well known as a field evaporation process in the STM regime. The two-terminal current-voltage characteristics of the CNT have been improved from a nonlinear behavior at 2.5 V of 208 kΩ to a linear one of 1.8 kΩ.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.